INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK
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United States of America Patent
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N/A
Issued Date -
May 21, 2009
app pub date -
Nov 15, 2007
filing date -
Nov 15, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board.
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