WIRELESS COMMUNICATION MODULES AND DEVICES
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United States of America Patent
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Issued Date -
May 21, 2009
app pub date -
Aug 22, 2008
filing date -
Nov 16, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wireless communication module is proposed, in which an LTCC substrate is employed. The LTCC substrate comprises at least a first layer and a second layer. At least first and second communication elements are deposited on the first layer, and a matching network is embedded in the second layer. The matching network couple the first and second communication elements to provide matched impedance, such that radio frequency signals are transmitted without distortion. Specifically, the first layer is the surface of the LTCC substrate, whereas the second layer is a depth inside the LTCC substrate. The matching network comprises at least one inductance or capacitance buried in the second layer.
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