Method of making a connection component with posts and pads
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United States of America Patent
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Nov 1, 2011
Grant Date -
May 28, 2009
app pub date -
Jan 16, 2009
filing date -
Oct 6, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
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