SUBSTRATE ATTACHING APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090133801A1
SERIAL NO

12255099

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate attaching apparatus and method are provided. The substrate attaching apparatus may include an upper chamber, a lower chamber, an upper chuck, a lower chuck, a position controller, and a discharging device. The lower chamber may adjoin the upper chamber to define an attaching space therewith. The upper chuck may be provided at a lower portion of the upper chamber so as to mount a first substrate thereon. The lower chuck may be recessed into an upper surface of the lower chamber and/or may be integrally formed with the lower chamber so as to mount a second substrate thereon. The position controller may be provided above the upper chamber to control a position of the first substrate. The discharging device may be provided above the upper chamber or below the lower chamber to apply vacuum pressure to the attaching space.

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Patent Owner(s)

Patent OwnerAddress
ADP ENGINEERING CO LTDGYEONGKI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIM, Seok Hee Seongnam-si, KR 4 16

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