Polyamide acid containing ultrafine metal particle
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United States of America Patent
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Issued Date -
May 28, 2009
app pub date -
Aug 28, 2006
filing date -
Sep 2, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method for producing a polyamic acid containing ultrafine metal particles, which contains the steps of contacting an aqueous solution containing a water-soluble metal compound with fine polyamic acid particles to adsorb metal ions to the fine polyamic acid particles, and then performing a reduction treatment; and a conductive adhesive which contains as an active ingredient the polyamic acid containing ultrafine metal particles. The conductive adhesive of the present invention has excellent performance which enables the adhesive to be used as an alternative to high-temperature lead solders.
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