VACUUM VAPOR DEPOSITION APPARATUS AND METHOD, AND VAPOR DEPOSITED ARTICLE FORMED THEREWITH

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United States of America Patent

APP PUB NO 20090136663A1
SERIAL NO

12274342

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Abstract

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When the ratio of a guest material to a host material is extremely small, it is difficult to maintain, with good accuracy, the ratio of the guest material to be vapor-deposited on the work surface and the distribution state of the guest material. The vacuum vapor deposition apparatus and method includes providing a shielding member, positioned between a first vapor deposition source and a substrate to be coated so that the vapor deposition amount of the guest material on the substrate surface is significantly less than the vapor deposition amount of the host material. A shielding member drive mechanism rotates the shielding member about a first axis while rotating the shielding member about a second axis, which is spaced from and parallel to the first axis.

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Patent Owner(s)

Patent OwnerAddress
FUJI ELECTRIC HOLDINGS CO LTDKANAGAWA KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GOHARA, Hiromichi Matsumoto City, JP 52 353
HAMA, Toshio Matsumoto City, JP 18 140
KIMURA, Hiroshi Matsumoto City, JP 313 3789
SANO, Shinji Matsumoto City, JP 23 142

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