POLISHING COMPOUND AND POLISHING METHOD
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United States of America Patent
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app pub date -
Nov 25, 2008
filing date -
May 31, 2006
priority date (Note) -
Abandoned
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Abstract
To provide a polishing compound which can satisfy both high removal rate of an object to be polished and excellent property to eliminate the difference in level, and to provide a polishing method which can polish a wiring metal fast while suppressing increase of a wiring metal resistance and is excellent in the property to eliminate the difference in level.
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