INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT
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United States of America Patent
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Issued Date -
Jun 4, 2009
app pub date -
Nov 30, 2007
filing date -
Nov 30, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected.
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