MEMS chip-to-chip interconnects
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United States of America Patent
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Issued Date -
Jun 4, 2009
app pub date -
Nov 21, 2008
filing date -
Nov 30, 2007
priority date (Note) -
Abandoned
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Abstract
A chip-to-chip interconnect system suited for MEMS that do not require low-resistance connections is described. The interconnects may be fabricated simultaneously with MEMS ribbon structures such as are found in MEMS optical modulators.
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