Ceramic-Copper Foil Bonding Method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 18, 2009
app pub date -
Dec 16, 2008
filing date -
Dec 18, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully