INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLIP CHIP
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United States of America Patent
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Issued Date -
Jun 18, 2009
app pub date -
Dec 17, 2007
filing date -
Dec 17, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit package system includes: mounting a flip chip over a carrier with a non-active side of the flip chip facing the carrier; mounting a substrate over the flip chip; connecting an internal interconnect between the flip chip and the carrier; and encapsulating the flip chip and the internal interconnect over the carrier with the substrate exposed.
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