Importance

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Abstract

A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the heat sink assembly. The heat sink assembly can be mounted onto a mounting clip or threaded directly onto a device having mating threads. The device can be a printed circuit board or components of a printed circuit board adapted to have threads or other electrical or electronic component that is adapted to have threads to receive the heat sink assembly. The fin disks are interference fit onto the cylindrical core to form a fin disk assembly to provide thermo-mechanical contact between the fin disks and the cylindrical core. The base is then interference fit onto the fin disk assembly to provide thermo-mechanical contact between the fin disk assembly and the base to form a heat sink assembly. The device can then be assembled to the electrical or electronic component requiring cooling.

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First Claim