UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE
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United States of America Patent
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Issued Date -
Jun 25, 2009
app pub date -
Dec 19, 2007
filing date -
Dec 19, 2007
priority date (Note) -
Abandoned
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Abstract
The under bump metallization (UBM) structure of semiconductor device comprises a substrate having a bonding pad disposed on an active surface; a UBM adhered on the bonding pad, wherein the UBM includes lateral embedded portions and the size of the UBM is larger than the size of the bonding pad; a dielectric layer over the UBM having opening that is smaller than the size of the UBM so as to allow the lateral embedded portions being embedded into the dielectric layer with a desired dimension; and a conductive ball melted on the UBM within the opening defined by the dielectric layer.
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