Top mount surface airflow heatsink and top mount heatsink component device
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United States of America Patent
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N/A
Issued Date -
Jun 25, 2009
app pub date -
Nov 1, 2007
filing date -
Nov 3, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
being the free-stream fluid velocity, d being the pipe distance or diameter, μ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.
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