Thin multi-chip flex module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jul 2, 2009
app pub date -
Dec 29, 2008
filing date -
Jan 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A flexible circuit comprises two flexible dielectric sheets having conductive patterns on their surface(s) to which microelectronic device(s) are attached. A bond layer joins the two sheets over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers.
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