POLISHING PAD AND POLISHING METHOD

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United States of America Patent

APP PUB NO 20090170409A1
SERIAL NO

12192350

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix.

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Patent Owner(s)

Patent OwnerAddress
IV TECHNOLOGIES CO LTDNO 12 ROAD 9 TAICHUNG INDUSTRIAL PARK TAICHUNG CITY 407

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shih, Wen-Chang Taichung , TW 18 115
Wang, Chao-Chin Taichung City , TW 5 14

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