Probe Card and Manufacturing Method Thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090174422A1
SERIAL NO

11992485

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A probe card usable at a higher temperature and a manufacturing method thereof are provided. Each of the junction interfaces of the contact probes and the electrode pads is made from the same metal material, wherein each of the junction interfaces is irradiated with ions in vacuum to remove impurities, followed by positioning so as to associate each of the junction interfaces while maintaining a vacuum state. Therefore, mutual bonding of the bonds in the respective junction interfaces is achieved to associate the junction interfaces with one another at normal temperature, where it is not necessary to form a melting layer having a low melting point between the contact probes and the electrode pads in such a case as using the melting layer to join them. Accordingly, if a metal material having a high melting point is used for the contact probes and the electrode pads, the contact probes and the electrode pads do not melt until high temperature is reached, which makes it possible to provide a probe card usable at a higher temperature.

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Patent Owner(s)

Patent OwnerAddress
JAPAN ELECTRONIC MATERIALS CORPORATION2-5-13 NISHINAGASU-CHO AMAGASAKI-SHI HYOGO 6600805 ?6600805

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Machida, Kazumichi Hyogo , JP 14 142

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