Bond Reinforcement Layer for Probe Test Cards
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Mar 5, 2009
filing date -
Jul 21, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.
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