POLISHING COMPOSITION
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United States of America Patent
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N/A
Issued Date -
Jul 16, 2009
app pub date -
Dec 22, 2008
filing date -
Dec 28, 2007
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure.; the degree of association of the first abrasive grains is from 1.8 to 5; and the degree of association of the second abrasive grains is at most 2.5.
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