System and method for disassembling laminated substrates
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United States of America Patent
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Feb 21, 2012
Grant Date -
Jul 23, 2009
app pub date -
Jan 18, 2008
filing date -
Jan 18, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.
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