Conductive line structure and the method of forming the same
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United States of America Patent
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Issued Date -
Jul 23, 2009
app pub date -
Jan 17, 2008
filing date -
Jan 17, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The conductive line structure of a semiconductor device including a base; at least one patterned conductive layer formed over the base; a conductive line formed over the at least one patterned conductive layer; a protection layer that encompasses the top surface and sidewall of the conductive line to prevent undercut generated by etching. The structure further comprises an underlying layer under the conductive line. The underlying layer includes Ni, Cu or Pt. The conductive line includes gold or copper. The at least one patterned conductive layer includes at least Ti/Cu. The protection layer includes electro-less plating Sn, Au, Ag or Ni.
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