SYSTEM FOR HANDLING SEMICONDUCTOR DIES
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United States of America Patent
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Issued Date -
Jul 30, 2009
app pub date -
Jan 30, 2008
filing date -
Jan 30, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a system for handling semiconductor dies, comprising providing a semiconductor die adhered to a tacky tape, cooling the semiconductor die and the tacky tape to reduce the adhesion between the semiconductor die and the tacky tape, separating the semiconductor die from the tacky tape, and moving the semiconductor die.
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