Component for semicondutor processing apparatus and manufacturing method thereof
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United States of America Patent
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Jun 23, 2006
filing date -
Jun 23, 2005
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Abstract
A component (10) for a semiconductor processing apparatus includes a matrix (10a) defining a shape of the component, and a protection film (10c) covering a predetermined surface of the matrix. The protection film (10c) consists essentially of an amorphous oxide of a first element selected from the group consisting of aluminum, silicon, hafnium, zirconium, and yttrium. The protection film (10c) has a porosity of less than 1% and a thickness of 1 nm to 10 .mu.m.
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