SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
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United States of America Patent
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Issued Date -
Aug 6, 2009
app pub date -
Dec 24, 2008
filing date -
Dec 27, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
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