Polishing Composition and Polishing Method Using The Same
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United States of America Patent
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Issued Date -
Aug 6, 2009
app pub date -
Jan 30, 2009
filing date -
Feb 1, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.
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