ELECTROCHEMICAL SENSING AND DATA ANALYSIS SYSTEM, APPARATUS AND METHOD FOR METAL PLATING
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United States of America Patent
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Issued Date -
Aug 13, 2009
app pub date -
Jun 18, 2007
filing date -
Jun 20, 2006
priority date (Note) -
Abandoned
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Abstract
An electrochemical sensing and data analysis system (and apparatus and methods) adapted for control of electroplating of various metal(s) on a wafer or other suitable substrate. Components of the system utilize multi-variate analysis (MVA) and galvanostatic, potentiodynamic or other electrical measurements (or combinations thereof) to predict, adjust or control plating parameters, e.g., to achieve improved yield of plated substrates with acceptable levels of defects (or lack thereof).
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