ELECTRONIC PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
Aug 20, 2009
app pub date -
Jun 20, 2008
filing date -
Feb 18, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
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