BINDERLESS METAL INJECTION MOLDING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Aug 20, 2009
app pub date -
Feb 20, 2008
filing date -
Feb 20, 2008
priority date (Note) -
Abandoned
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Abstract
A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first die half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.
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