SOLDER ALLOY FOR OXIDE BONDING
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United States of America Patent
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Issued Date -
Aug 20, 2009
app pub date -
Jul 13, 2006
filing date -
Jul 14, 2005
priority date (Note) -
Abandoned
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Abstract
A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects.
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