Wave Soldering Bath
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United States of America Patent
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N/A
Issued Date -
Aug 27, 2009
app pub date -
Mar 13, 2006
filing date -
Apr 6, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Problem: In a conventional wave soldering bath, oxides which intermixed with molten solder were sucked into a duct from a suction port of the duct and were discharged from a discharge nozzle and adhered to printed circuit boards.Means for Solving the Problem: In a wave soldering bath according to the present invention, an oxide reservoir is provided at one end of the bath body which is opposite from the end thereof where a pump is installed, and a gutter which is closed off on the pump side is mounted on the side surface of the discharge nozzle. A perforated plate having a large number of holes formed therein is pivotably installed at a middle height of the oxide reservoir.
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