Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape
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United States of America Patent
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Issued Date -
Sep 3, 2009
app pub date -
Feb 29, 2008
filing date -
Feb 29, 2008
priority date (Note) -
Abandoned
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Abstract
A lamination tape is disclosed which includes a base film with an adhesive layer on one side wherein the coefficient of thermal expansion (CTE) of the adhesive layer is adapted so as to reduce warpage of a semiconductor die when the lamination tape is attached to the passive side of the semiconductor die.
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