Polishing compound for semiconductor wafer polishing and polishing method

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United States of America Patent

APP PUB NO 20090223136A1
SERIAL NO

12230353

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Abstract

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as indicated by molar ratio of tetraethylammonium/silica.

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Patent Owner(s)

Patent OwnerAddress
NIPPON CHEMICAL INDUSTRIAL CO LTDTOKYO 136-8515
SPEEDFAM CO LTDJAPAN'S KANAGAWA COUNTY LAI LAI CITY FOUR 2 37 AIKAWA-SHI KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Izumi, Masahiro Koto-ku , JP 55 679
Maejima, Kuniaki Koto-ku , JP 9 76
Miyabe, Shinsuke Koto-ku , JP 17 60
Nakajo, Masaru Koto-ku , JP 15 74
Tanaka, Hiroaki Ayase-shi , JP 532 5487

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