Integrated circuit with step molded inner stacking module package in package system
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United States of America Patent
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Jan 25, 2011
Grant Date -
Sep 10, 2009
app pub date -
Mar 10, 2008
filing date -
Mar 10, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.
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