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Abstract

A method of filling high aspect ratio features with active electronic or conductive materials. In one method, high pressure extrusion is used to urge the as-deposited active or conductive material into an incompletely filled opening. In another method, a rapid thermal anneal process is used to induce reflow of the as-deposited active or conductive material into an incompletely filled opening. Both methods are also effective in densifying active or conductive materials within openings by collapsing voids that arise in the as-deposited state. The instant methods provide for more uniform and consistent filling of openings and minimize the variability and impairment of electrical characteristics of active material devices. Active materials include phase-change materials, chalcogenide materials, switching materials, and programmable resistance materials.

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First Claim