POROUS GAS HEATING DEVICE FOR A VAPOR DEPOSITION SYSTEM
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United States of America Patent
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Issued Date -
Sep 10, 2009
app pub date -
Mar 4, 2008
filing date -
Mar 4, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and system for treating a substrate is described. For example, the method and system may be used to deposit a thin film on a substrate using a vapor deposition process. The processing system comprises a gas distribution device for controlling the temperature of a process gas, such as one or more constituents of a film forming composition. The gas distribution device comprises one or more porous gas distribution elements configured to be temperature controlled and distribute a process gas flowing through the one or more porous gas distribution elements. The gas distribution device may be configured to pyrolize the process gas.
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