LED PACKAGE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Sep 17, 2009
app pub date -
Sep 23, 2008
filing date -
Mar 17, 2008
priority date (Note) -
Abandoned
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Abstract
The present invention relates to light emitting diode (LED) packages and methods of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same that can reduce a variation of color coordinates of mass-produced LED packages.
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