Photosensitive Resin Composition and Laminates
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United States of America Patent
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Issued Date -
Sep 17, 2009
app pub date -
Jul 22, 2005
filing date -
Jul 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a photosensitive resin composition characterized by comprising: (a) 20 to 90% by mass of a thermoplastic copolymer comprising an α,β-unsaturated carboxyl group containing monomer as a copolymerization constituent and having an acid equivalent of 100 to 600 and a weight-average molecular weight of 5000 to 500000; (b) 5 to 75% by mass of an addition polymerizable monomer having at least one terminal ethylenic unsaturated group; (c) 0.01 to 30% by mass of a photopolymerization initiator containing a hexaarylbisimidazole; and (d) 0.001 to 10% by mass of a pyrazoline compound represented by the following general formula (I):(R represents a hydrogen atom or an alkyl group); and each of a, b, and c represents an integer of 0 to 2, provide that the value of a+b+c is 1 or larger).
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