COPPER CONTAINING POLYESTER-POLYAMIDE COMPOSITIONS

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United States of America Patent

SERIAL NO

12399499

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Abstract

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The specification claims the unexpected result that copper containing compounds can be used to impart thermal stability to a polyester polyamide mixture, when the mixture contains an ionic compatibilizer such as sulfoisophthalic acid.

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Patent Owner(s)

Patent OwnerAddress
APG POLYTECH LLCCORPORATE TRUST CENTER 1209 ORANGE STREET WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Elliot, Guliz Arf Northfield Center , US 1 2
ERGUNGOR, ZEYNEP Hudson , US 1 2
Ferrari, Gianluca Medina , US 28 131

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