Integrated circuit package system with support structure for die overhang
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United States of America Patent
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Aug 2, 2011
Grant Date -
Sep 24, 2009
app pub date -
Mar 19, 2008
filing date -
Mar 19, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation.
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