Method of Applying Catalytic Solution for Use in Electroless Deposition
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United States of America Patent
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Issued Date -
Sep 24, 2009
app pub date -
Mar 21, 2008
filing date -
Mar 21, 2008
priority date (Note) -
Abandoned
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Abstract
An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.
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