Hermetically Sealed Device with Transparent Window and Method of Manufacturing Same
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2009
app pub date -
Mar 28, 2008
filing date -
Mar 28, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention is a hermetically sealed semiconductor die package wherein a surface of the die can be positioned very close to the hermetic package and a method of fabricating such a package. The invention is particularly suited to hermetically sealed circuit components, such as dies with a light emitting surface or light receiving surface for which it would be desirable to place the light emitting or light receiving surface as close as possible to a transparent window in the package so as to maximize the amount of light that can be transmitted out of the package.
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