INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2009
app pub date -
Mar 26, 2008
filing date -
Mar 26, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An integrated circuit package system including: providing a substrate with a wire-bonded die mounted thereover; mounting a first support structure and a second support structure of different size above the substrate; mounting a structure above the first support structure and the second support structure; and encapsulating the wire-bonded die, the first support structure and the second support structure with an encapsulation.
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Cited Art Landscape
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