INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 1, 2009
app pub date -
Mar 26, 2008
filing date -
Mar 26, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
An integrated circuit package system comprising: forming a base package having a molded top; providing a surface contact on the base package; and patterning a redistribution layer on the molded top for coupling the surface contact.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully