Semiconductor structure
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2009
app pub date -
Mar 31, 2008
filing date -
Mar 31, 2008
priority date (Note) -
Abandoned
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Abstract
A fusible link between metallization layers of a semiconductor device comprises a tungsten plug deposited in a via interconnecting two aluminum metallization layers.
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