CARRIER PARTICLES FOR FORMING WIRING CIRCUIT PATTERN AND DEVELOPER
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United States of America Patent
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N/A
Issued Date -
Oct 1, 2009
app pub date -
Mar 6, 2009
filing date -
Mar 31, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Carrier particles for forming a wiring circuit pattern by an electrophotographic developing method which are used for directly forming a circuit shape on an insulating layer, with any of a metal powder, an inorganic compound powder, or a mixed raw material powder thereof used as a toner powder for forming a circuit, the toner powder for forming a circuit being adhered to a surface of the carrier particles by electrostatic force and then transported to a surface of the insulating layer, wherein the carrier particles include a resin coated layer of an acrylic resin composition containing an amino-group-containing polymer on the surface of the carrier core material particles, the coating amount of the acrylic resin composition is 0.3 to 3.0% by weight based on a carrier core material weight of 100% by weight, and a shape factor SF-1 of the carrier core material particles is 100 to 110.
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