GRINDING METHOD FOR GRINDING BACK-SURFACE OF SEMICONDUCTOR WAFER AND GRINDING APPARATUS FOR GRINDING BACK-SURFACE OF SEMICONDUCTOR WAFER USED IN SAME
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United States of America Patent
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Issued Date -
Oct 1, 2009
app pub date -
Mar 4, 2009
filing date -
Mar 31, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A grinding method for grinding a back surface of a semiconductor wafer that performs infeed grinding of a back surface of a wafer laminated body, the method, during the grinding of the back surface of the wafer laminated body, having: measuring respectively a thickness of an outer peripheral portion and an inner peripheral portion of the wafer laminated body; calculating a thickness difference between the thickness of the outer portion and the thickness the inner portion; and tilting an axis of a grinding wheel by a predetermined angle in an arbitrary direction so as to reduce the calculated thickness difference.
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