Solder applying apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
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app pub date -
Apr 2, 2008
filing date -
Apr 2, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A solder applying apparatus includes a tray body having a base portion and a surrounding portion extending from a periphery of the base portion, cooperating with the base portion to define a solder-accommodating space therebetween for receiving a solder material therein, and having a top end distal from the base portion. The base portion has an inner wall confining a bottom side of the solder-accommodating space. The inner wall of the base portion is divided into a plurality of parallel planar regions. Each of the planar regions cooperates with an adjacent one of the planar regions to define a step therebetween so as to permit the planar regions to have different depths relative to the top end of the surrounding portion.
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