Three chip package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20090251119A1
SERIAL NO

12228476

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multi-chip package that includes two power semiconductor devices coupled in a half-bridge arrangement and a driver for driving the two power semiconductor devices.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL RECTIFIER CORPORATION233 KANSAS STREET (A CORPORATION OF DELAWARE) EL SEGUNDO CA 90245

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Palasi, Primitivo A Baguio , PH 6 171
Stojcic, Goran Redondo Beach , US 5 54

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