Cleaning apparatus for semiconductor wafer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8567420
APP PUB NO 20090255558A1
SERIAL NO

12412638

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Abstract

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A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inukai, Minako Kawasaki, JP 20 55
Ji, Linan Yokohama, JP 12 208
Tomita, Hiroshi Yokohama, JP 314 3966
Umezawa, Kaori Kamakura, JP 21 188
Yoshimizu, Yasuhito Yokohama, JP 84 365

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