Cleaning apparatus for semiconductor wafer
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United States of America Patent
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Oct 29, 2013
Grant Date -
Oct 15, 2009
app pub date -
Mar 27, 2009
filing date -
Mar 31, 2008
priority date (Note) -
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Abstract
A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.
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