Sn-CONTAINING COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

SERIAL NO

11573638

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Abstract

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A Sn-containing copper alloy, contains Sn: 0.01 to 16 mass %, Zr: 0.001 to 0.049 mass %, P: 0.01 to 0.25 mass %, and Cu: remainder; satisfying f0=[Cu]−0.5[Sn]−3[P]=61 to 97, f1=[P]/[Zr] 0.5 to 100, f2=3[Sn]/[Zr]=30 to 15000 and f3=3[Sn]/[P]=3 to 2500 (the content of element ‘a’ is represented as [a] mass %). α and γ-phases and/or δ-phase are included and the total content of the α and γ-phases and/or δ-phase reaches 90% or more by area ratio, and the mean grain size of the macrostructure during melt-solidification is 300 μm or less.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI SHINDOH CO LTDTOKYO 140-8550

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oishi, Keiichiro Osaka , JP 78 383

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